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Every materials introduced into cleanroom is a potential source of AMC. The chemical composition of a material, its surface area and its temperature ultimately determine the levels of contamination introduced into the cleanroom environment. Those contaminations that condense on critical process components can lead to "AMC Defects" such as changes in the electrical properties of wafers, uncontrolled boron and phosphorus doping, etch rate shift, threshold voltage shifts, wafer and stepper optics hazing and high contact sensitive. As line widths of microelectronic devices shrink "AMC Defects" have become a major concern and will need to be considered in the design of future cleanrooms.

Airborne Molecular Contaminants (AMC) can negatively affect semiconductor yields by contaminating wafers and virtually all process instrumentation and tools. Cleanroom air may be re-circulated across different areas of the fab, leading to cross contamination. If these concentrations reach threshold levels, yields can suffer.

Our AMC monitoring and technical team has extensive experiences in serving the semiconductor and disc drive industries for the monitoring of the following five classes of AMC:

• Molecular Acid (MA)
• Molecular Base (MB)
• Molecular Condensable (MC, Organics)
• Molecular Dopant (MD)
• Amosite Asbestos
• Molecular Metal (MM)
  
  

The team is a highly specialized group, which has unique capability with specialized instrumentation of providing cleanroom airborne contamination consultation, on-site testing, laboratory analysis, result interpretation, and recommendations for your cleanroom environment